All of which had to do with heat management.
The problem with the Xbox 360 overheating and requiring repairs is a multifaceted subject. It involves Microsoft cutting corners during research and development, as well as bypassing the testing process required to ensure that the console was free of errors before putting it on the market. The heart of the matter is the heat generated during operation. The solder used to attach the GPU chip and the CPU chip to the motherboard is unable to withstand these temperatures. In essence, the heat causes the solder to become brittle and fragile, forming cracks and fissures in the soldered joints. The heat sinks used to cool the chips are too small to operate effectively, and the protective thermal paste used on the chips is likewise ineffective against overheating.